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d a t a sh eet product specification supersedes data of 3rd may 2001 file under bccomponents, bc06 2001 jun 13 bccomponents class 1, np0 low voltage 10, 16, 25 and 50 v surface mount multilayer chip capacitors d a t a sh eet product specification supersedes data of 3rd may 2001 file under bccomponents, bc06 2001 jun 13 bccomponents class 1, np0 low voltage 10, 16, 25 and 50 v surface mount multilayer chip capacitors
2001 jun 13 2 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v features ? ultra stable class 1 dielectric ? six standard sizes ? high capacitance per unit volume ? supplied in tape on reel or bulk in a polythene bag ? for high frequency applications ? ni-barrier terminations. applications ? consumer electronics ? telecommunications ? automotive ? data processing. description the capacitor consists of a rectangular block of ceramic dielectric in which a number of interleaved precious metal electrodes are contained. this structure gives rise to a high capacitance per unit volume. the inner electrodes are connected to the two terminations by silver dipping with a barrier layer of plated nickel and finally covered with a layer of plated tin (nisn). a cross section of the structure is shown in fig.1. quick reference data description value rated voltage u r (dc) 10 v; 16 v; 25 v; 50 v capacitance range, for size code: 0402 0.5 to 150 pf 0603 0.5 pf to 1 nf 0805 0.5 pf to 1.5 nf 1206 1.5 pf to 3.3 nf 1210 22 pf to 5.6 nf 1812 1 nf to .010 f tolerance on capacitance: c 10 pf 2%; 5%; 10% c < 10 pf 0.5 pf; 0.25 pf; 0.1 pf test voltage (dc) for 1 minute 2.5 u r climatic category (iec 68) 55/125/56 jw115 terminations electrodes ceramic material fig.1 construction of a multilayer chip capacitor.
2001 jun 13 3 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v mechanical data physical dimensions table 1 capacitor dimensions; see fig.2 size code l w t mb min. max. dimensions in millimetres 0402 1.0 0.05 0.5 0.05 0.45 0.55 0.25 +0.05/ ? 0.10 0603 1.6 0.10 0.8 0.07 0.73 0.87 0.40 0.15 0805 2.0 0.15 1.25 0.15 0.50 1.35 0.50 0.20 1206 3.2 0.15 1.6 0.15 0.50 1.75 0.60 0.20 1210 3.2 0.30 2.5 0.20 0.50 1.80 0.75 0.25 1812 4.5 0.40 3.2 0.30 0.50 1.80 0.75 0.25 dimensions in inches 0402 0.040 0.002 0.020 0.002 0.018 0.022 0.010 0.006 0603 0.063 0.004 0.030 0.004 0.029 0.035 0.015 0.006 0805 0.080 0.006 0.050 0.006 0.020 0.053 0.020 0.008 1206 0.125 0.006 0.063 0.006 0.020 0.069 0.025 0.008 1210 0.125 0.012 0.100 0.008 0.020 0.072 0.030 0.010 1812 0.180 0.015 0.125 0.012 0.020 0.072 0.030 0.010 jw114 t l mb mb w fig.2 component outline. for dimensions see table 1.
2001 jun 13 4 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v selection chart for 10 and 16 v note 1. for thickness classification, see ?thickness classification and packaging quantities?. c (pf) 10 v 16 v 0402 0603 0805 1206 1210 1812 0402 0603 0805 1206 1210 1812 0.5 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 n (1) n (1) 12 15 a (1) a (1) 18 22 27 33 s (1) s (1) 39 47 56 b (1) b (1) 68 82 100 120 150 180 220 270 c (1) c (1) 330 390 470 560 680 b (1) b (1) 820 1000 1200 1500 1800 2200 2700 3300 c (1) d (1) c (1) d (1) 3900 4700 5600 6800 8200 10000
2001 jun 13 5 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v thickness classification and packaging quantities note 1. a 13" reel is available on request. thickness classification (mm) 8 mm tape width amount per reel 12 mm tape width amount per reel ? 180 mm; 7"; note 1 0402 0603 0805 1206 1210 1812 paper paper paper paper blister blister blister a = 0.65 +0.05/ ? 0.15 ?? 4000 ??? ? b = 0.85 +0.05/ ? 0.15 ?? 4000 4000 ?? ? c = 1.00 +0.05/ ? 0.15 ???? 3000 3000 ? d = 1.20 +0.15/ ? 0.15 ?????? 1000 s = 0.80 0.07 ? 4000 ???? ? n = 0.50 0.05 10000 ????? ? ordering information for 10 and 16 v components may be ordered by using either a simple 14-digit clear text code, or bccomponents 12nc. clear text code e xample : 0402n101j100nt ordering code 12nc size code dielectric capacitance (pf) tolerance voltage technology packaging 0402 0603 0805 1206 1210 1812 n = cog (np0) two significant digits followed by the number of zeros: 101 = 100 102 = 1000 152 = 1500 103 = 10000 b = 0.1 pf c= 0.25 pf d= 0.50 pf g= 2% j= 5% k= 10% 100 = 10 v 160 = 16 v n = noble metal t = 7" reel/paper g = 13" reel/paper p = 7" reel/blister l = 13" reel/blister b = bulk/ polythene bag (1) refer to chapter ? selection chart for 10 and 16 v ? . 2 2 5 2 x x x x x x x x dielectric and tolerance rated voltage 1 2 3 4 10 v 16 v 25 v 50 v 5 6 7 8 9 100 v 200 v 500 v 1000 v others size 1 2 3 4 5 6 7 0402 0603 0805 1206 1210 1808 1812 multiplier capacitance (pf) two significant digits of capacitance value 1 2 3 4 5 6 7 8 9 packaging 0 1 2 3 4 bulk paper: ? 180 mm; 7" paper: ? 330 mm; 13" blister: ? 180 mm; 7" blister: ? 330 mm; 13" jw129 10 100 1 000 10 000 100 000 1 000 000 others: 10 000 000 np0: 0.01 0.10 1.00 00 01 02 03 04 05 07 08 10 11 12 np0 ni 0.1 pf np0 ni 0.25 pf np0 ni 0.5 pf np0 ni 2% np0 ni 5% np0 ni 10% y5v ni 20% y5v ni ? 20/+80% x7r ni 5% x7r ni 10% x7r ni 20%
2001 jun 13 6 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v selection chart for 25 and 50 v note 1. for thickness classification, see ? thickness classification and packaging quantities ? . c (pf) 25 v 50 v 0402 0603 0805 1206 1210 1812 0402 0603 0805 1206 1210 1812 0.5 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 n (1) 10 12 n (1) 15 a (1) 18 a (1) 22 27 33 s (1) 39 s (1) 47 56 b (1) 68 b (1) 82 100 120 150 180 220 270 330 c (1) b (1) 390 470 560 680 b (1) 820 b (1) 1000 1200 1500 1800 2200 2700 d (1) 3300 c (1) d (1) c (1) 3900 4700 5600 6800 8200 10000
2001 jun 13 7 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v thickness classification and packaging quantities note 1. a 13" reel is available on request. thickness classification (mm) 8 mm tape width amount per reel 12 mm tape width amount per reel ? 180 mm; 7"; note 1 0402 0603 0805 1206 1210 1812 paper paper paper paper blister blister blister a = 0.65 +0.05/ ? 0.15 ?? 4000 ??? ? b = 0.85 +0.05/ ? 0.15 ?? 4000 4000 ?? ? c = 1.00 +0.05/ ? 0.15 ???? 3000 3000 1000 d = 1.20 +0.15/ ? 0.15 ?????? 1000 s = 0.80 0.07 ? 4000 ???? ? n = 0.50 0.05 10000 ????? ? ordering information for 25 and 50 v components may be ordered by using either a simple 14-digit clear text code, or bccomponents 12nc. clear text code e xample : 0402n100j250nt ordering code 12nc size code dielectric capacitance tolerance voltage technology packaging 0402 0603 0805 1206 1210 1812 n = cog (np0) two significant digits followed by the number of zeros: 101 = 100 102 = 1000 152 = 1500 103 = 10000 b = 0.1 pf c= 0.25 pf d= 0.50 pf g= 2% j= 5% k= 10% 250 = 25 v 500 = 50 v n = noble metal t = 7" reel/paper g = 13" reel/paper p = 7" reel/blister l = 13" reel/blister b = bulk/ polythene bag (1) refer to chapter ? selection chart for 25 and 50 v ? . 2 2 5 2 x x x x x x x x dielectric and tolerance rated voltage 1 2 3 4 10 v 16 v 25 v 50 v 5 6 7 8 9 100 v 200 v 500 v 1000 v others size 1 2 3 4 5 6 7 0402 0603 0805 1206 1210 1808 1812 multiplier capacitance (pf) two significant digits of capacitance value 1 2 3 4 5 6 7 8 9 packaging 0 1 2 3 4 bulk paper: ? 180 mm; 7" paper: ? 330 mm; 13" blister: ? 180 mm; 7" blister: ? 330 mm; 13" jw129 10 100 1 000 10 000 100 000 1 000 000 others: 10 000 000 np0: 0.01 0.10 1.00 00 01 02 03 04 05 07 08 10 11 12 np0 ni 0.1 pf np0 ni 0.25 pf np0 ni 0.5 pf np0 ni 2% np0 ni 5% np0 ni 10% y5v ni 20% y5v ni ? 20/+80% x7r ni 5% x7r ni 10% x7r ni 20%
2001 jun 13 8 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v electrical characteristics class 1 capacitors; np0 dielectric; nisn terminations unless otherwise stated all electrical values apply at an ambient temperature of 20 1 c, an atmospheric pressure of 86 to 106 kpa, and a relative humidity of 63 to 67%. description value capacitance range, for size code: 0402 0.5 to 150 pf 0603 0.5 pf to 1 nf 0805 0.5 pf to 1.5 nf 1206 1.5 pf to 3.3 nf 1210 22 pf to 5.6 nf 1812 1 nf to .010 f tolerance on capacitance: c 10 pf 2%; 5%; 10% c < 10 pf 0.1 pf; 0.5 pf; 0.25 pf q: c 30 pf q 1000 c < 30 pf q 400 + 20c insulation resistance after 1 minute at u r (dc) 100 g ? min. or 1000 ? f min., whichever is less temperature coefficient 30 10 ? 6 /k ageing not applicable
2001 jun 13 9 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v packaging tape on reel packaging conforms fully with ?iec 60286-3? , ?eia 481-1? and ?jis c0806? industrial standards. multilayer chip capacitors are supplied on tape on reel or bulk in a polythene bag. for mlccs with a product thickness of <1 mm, paper tape is preferred. mlccs with a product thickness of 1 mm, are supplied in blister tape. c arrier tape polycarbonate. table 2 properties of carrier tape c over tape polyester (antistatic). table 3 properties of cover tape general information for the combination carrier/cover tape no electrostatic behaviour is observed (relative humidity 30%). the products do not stick to the cover tape. the technical and thermal properties of polycarbonate tapes are excellent, so there is no change in dimensions as a function of time. the peel off force is very stable as a function of time and temperature, and it is defined as 0.1 to 0.7 n at a peel-off speed of 120 mm/minute. parameter width 8.1 0.2 mm 12 0.2 mm thickness 190 to 280 m 240 20 m tensile strength at break > 60 n/mm 2 > 60 n/mm 2 elongation at break 100 to 150% 100 to 150% surface resistance > 10 12 ? /sq. > 10 12 ? /sq. parameter width 5.5 0.1 mm 9.5 0.1 mm breaking force 10.7 n 17.6 n elongation at break 63% 63% surface resistance <10 10 ? /sq. <10 10 ? /sq. softening point 71 5 c71 5 c thickness 62 m62 m
2001 jun 13 10 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v paper tape specifications table 4 dimensions of paper tape for relevant product size, in millimetres; see fig.3 note 1. p 0 pitch tolerance over any 10 pitches is 0.2 mm. symbol product size code 0402 0603 0805 1206 size tol. size tol. size tol. size tol. a 0 0.62 0.05 1.10 0.05 1.65 0.05 2.0 0.1 b 0 1.12 0.05 1.90 0.05 2.40 0.05 3.5 0.1 w8.00.28.0 0.3 8.0 0.2 8.0 0.2 e1.750.11.75 0.1 1.75 0.1 1.75 0.1 f 3.5 0.05 3.5 0.05 3.5 0.05 3.5 0.05 d 0 1.5 +0.1/-0 1.5 +0.1/ ? 0 1.5 +0.1/ ? 0 1.5 +0.1/ ? 0 p 0 ; note 1 4 0.05 4 0.1 4 0.05 4 0.05 p 1 2 0.05 4 0.1 4 0.1 4 0.1 p 2 2 0.05 2 0.05 2 0.05 2 0.05 t 1 max 0.6 0.05 1.05 0.05 0.95 0.05 0.95 0.05 t 2 max 0.62 0.05 1.2 0.05 0.95 0.05 0.95 0.05 fig.3 paper tape. for dimensions see table 4 . f w p 0 p 2 d 0 b 0 a 0 p 1 e jw120 t 1 t 2
2001 jun 13 11 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v blister tape specifications table 5 dimensions of blister tape for relevant product size code, in millimetres; see fig.4 notes 1. typical capacitor displacement in pocket. 2. p 0 pitch tolerance over any 10 pitches is 0.2 mm. dimension product size code tolerance 0805 1206 1210 1812 a 0 nominal clearance; note 1 0.20 0.30 0.30 0.40 ? b 0 nominal clearance; note 1 0.20 0.30 0.30 0.40 ? k 0 minimum clearance; note 1 0.05 0.05 0.05 0.05 ? w 8.0 8.0 8.0 12.0 0.3 e 1.75 1.75 1.75 1.75 0.1 f 3.5 3.5 3.5 5.5 0.05 d 0 1.5 1.5 1.5 1.5 +0.1/ ? 0.0 d 1 1 1 1 1.5 +0.1/ ? 0.0 p 0 ; note2 4444 0.1 p 1 4448 0.1 p 2 2222 0.05 t max 0.3 ??? ? t 1 cover tape 0.05 ??? ? t 2 2.0 ??? ? fig.4 blister tape. k 0 : so chosen that the orientation of the component cannot change. for dimensions see table 5. jw119 e f w p 2 p 0 d 0 b 0 a 0 d 1 p 1 direction of unreeling k t 0 cover tape t 1 t 2
2001 jun 13 12 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v reel specifications table 6 reel dimensions and tape width for relevant chip size; see fig.5 note 1. a 13" reel is available on request. properties of reel material: polystyrene surface resistance: <10 10 ? /sq. dimension (mm) 8mm tape width 12 mm tape width ? 180 mm; 7"; note 1 0402 0603 0805 1206 1210 1812 a 13.0 1.0 13.0 1.0 13.0 1.0 13.0 0.5 13.0 1.0 13.0 1.0 b9.0 1.0 9.0 1.0 9.0 1.0 9.0 0.5 9.0 1.0 13.5 1.0 c 178.0 1.0 178.0 1.0 178.0 1.0 178.0 1.0 178.0 1.0 178.0 1.0 d 60.5 1.0 60.5 1.0 60.5 1.0 60.5 1.0 60.5 1.0 80.0 1.0 dc b jw121 a fig.5 reel. dimensions in mm. for dimensions see table 6.
2001 jun 13 13 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v leader/trailer tape specification fig.6 leader/trailer tape. jw125 empty compartments with cover tape cover tape only 120 40 mm leader 400 mm trailer (max. 260 mm) trailer end leader end table 7 leader/trailer tape data description value minimum length of empty compartments at leader end 400 mm of which a minimum 240 mm of empty compartments are covered with cover tape and 120 40 mm cover tape only minimum length of empty compartments at trailer end 208 mm or 260 mm. if the length is 260 mm an extra product is placed at 208 mm to mark this position.
2001 jun 13 14 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v method of mounting and dimensions of solder lands for normal use the capacitors may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapour phase soldering) or conductive adhesive in accordance with cecc 00802 classification a. for advised soldering profiles see figs 7, 8 and 9. an improper combination of soldering, substrate and chip size can lead to a damaging of the component. the risk increases with the chip size and with temperature fluctuations ( > 100 c). therefore, it is advised to use the smallest possible size and follow the dimensional recommendations given in tables 8 and 9 for reflow and wave soldering. more detailed information is available on request. fig.7 reflow soldering. typical values (solid line). process limits (dotted lines). 0 50 100 150 200 250 300 250 200 150 100 50 0 10 s 260 c 130 c ( c) t (s) jw122 245 c 215 c 180 c 10 s 40 s 2 k/s t
2001 jun 13 15 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v fig.8 double wave soldering. typical values (solid line). process limits (dotted lines). the capacitors may be soldered twice in accordance with this method if desired. 0 50 100 150 200 250 300 250 200 150 100 50 0 10 s 235 c to 260 c second wave 5 k/s 2 k/s first wave 200 k/s 100 c to 130 c forced cooling 2 k/s ( c) t (s) t jw123 fig.9 vapour phase soldering. typical values (solid line). process limits (dotted line). 0 50 100 150 200 250 300 250 200 150 100 50 0 ( c) t (s) 215 c 180 c 20 to 40 s internal preheating, e.g. by infrared, max. 2 k/s 100 c 130 c external preheating forced cooling t jw124
2001 jun 13 16 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v fig.10 recommended dimensions of solder lands. jw117 e b a f c dg preferred direction during wave soldering solder land / solder paste pattern solder resist pattern occupied area tracks e = available track area under the mlcc. table 8 reflow soldering; for dimensions also see fig.10 table 9 wave soldering (no dummy tracks allowed for 500 v); for dimensions also see fig.10 size code footprint dimensions (mm) processing remarks placement accuracy (mm) abcde fg 0402 1.5 0.5 0.5 0.5 0.10 1.75 0.95 ir or hot plate soldering 0.15 0603 2.3 0.7 0.8 0.9 0.26 2.7 1.5 0.15 0603 2.3 0.5 0.9 0.9 0.0 2.7 1.5 0.25 0805 2.8 0.9 0.95 1.4 0.45 3.2 2.1 0.25 1206 4.0 2.0 1.0 1.8 1.4 4.4 2.5 0.25 1210 4.0 2.0 1.0 2.7 1.4 4.4 3.4 0.25 1808 5.4 3.3 1.05 2.3 2.7 5.8 2.9 ceramic substrate only 0.25 1812 5.4 3.3 1.05 3.5 2.7 5.8 4.1 0.25 size code footprint dimensions (mm) proposed number and dimensions of dummy tracks (mm) placement accuracy (mm) abcde fg 0603 2.4 1.0 0.7 0.8 0.2 3.0 1.9 1 (0.2 0.8) 0.10 0603 2.7 0.9 0.9 0.8 0.0 3.2 2.1 1 (0.3 0.8) 0.25 0805 3.2 1.4 0.9 1.3 0.36 4.1 2.5 1 (0.3 1.3) 0.15 0805 3.4 1.3 1.05 1.3 0.2 4.3 2.7 1 (0.2 1.3) 0.25 1206 4.8 2.3 1.25 1.7 1.25 5.9 3.2 3 (0.25 1.7) 0.25 1210 5.3 2.3 1.5 2.6 1.25 6.3 4.2 3 (0.25 2.6) 0.25
2001 jun 13 17 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v test conditions in static solder bath parameter description solderability 95% covered with smooth and bright solder coating cecc requirement: 235 5 cfor2 0.5 s iec requirement: 215 3 cfor3 0.3 s resistance to leaching 10% of the metallization of the edges of the head face may be missing (inner electrodes are not visible) 260 5 c for 30 1s
2001 jun 13 18 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v tests and requirements ta b le 1 0 test procedures and requirements test procedure requirements visual and mechanical no visible damage dimensions in accordance with specification capacitance c 1000 pf, 1.0 0.2 v rms ; f = 1 mhz 10% c > 1000 pf, 1.0 0.2 v rms ; f = 1 khz 10% shall not exceed the limits given in the detailed specification q value c 1000 pf, 1.0 0.2 v rms ; f = 1 mhz 10% 30 pf: q 1000 <30 pf: q 400 + 20c c > 1000 pf, 1.0 0.2 v rms ; f = 1 khz 10% dielectric strength 250% of rated voltage for 1 to 5 s, charge and discharge current less than 50 ma no visible damage or flash-over during test insulation resistance at u r (dc) for max. 60 s 5 s 100 g ? min. or 1000 ? f min., whichever is less temperature coefficient with no electrical load: ? 55 to 125 c at t amb = 25 c 30 10 ? 6 / c bending test the middle part of the substrate shall be pressurized by means of the pressurizing rod at a rate of about 1 mm per second until the deflection becomes 1 mm and then the pressure shall be maintained for 5 1s measurement after 24 2 hours at room temperature no visible damage ? c/c: 5.0 max. or 0.5 pf max., whichever is greater this capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the test solderability 230 5 cfor2 0.5 s; solder: sn63a 95% min. coverage of entire metallized area resistance to soldering heat 260 5 c for 10 1s; solder: sn63a; measurement after 24 2 hours at room temperature no visible damage ? c/c: 2.5% max. or 0.25 pf max., whichever is greater df, r ins and dielectric strength to meet initial requirements 10% max. leaching on each edge temperature cycle ? 55 to 125 c; 5 cycles in the following sequence: ? 55 c ? 3/+0 for 30 3 minutes; room temperature for 2 to 3 minutes; 125 c +3/ ? 0 for 30 3 minutes; room temperature for 2 to 3 minutes measurement after 24 2 hours at room temperature no visible damage ? c/c: 2.5% max. or 0.25 pf max., whichever is greater df, r ins and dielectric strength to meet initial requirements
2001 jun 13 19 bccomponents product specification surface mount multilayer chip capacitors class 1, np0 low voltage 10, 16, 25 and 50 v humidity test (damp heat steady state) 40 2 c; 90 to 95% rh for 1000 +24/ ? 0 hours u r applied; measurement after 24 2 hours at room temperature no visual damage ? c/c: 2.0% max. or 1 pf max., whichever is greater q: 30 pf q 350 10 pf c < 30 pf, q 275 + 2.5c < 10 pf, q 200 +10c r ins : 10 g ? min. or 100 ? f min. whichever is less humidity load (damp heat) 40 2 c; 90 to 95% rh for 1000 +24/ ? 0 hours u r applied; measurement after 24 2 hours at room temperature no visual damage ? c/c: 7.5% max. or 0.75 pf max., whichever is greater q: 30 pf, q 200 c < 30 pf, q 100 + 10/3c r ins : 500 m ? min. or 25 ? f min. whichever is less adhesive strength of termination pressurizing force 1 kg (10 n) for 10 1 s no visible damage vibration resistance frequency: 10 to 55 to 10 hz/min.; total amplitude: 1.5 mm test time: 6 hours (2 hours each in 3 mutually perpendicular directions) no visible damage or removal of the terminations high temperature load (endurance) 125 3 c; 200% of rated voltage for 1000 +24/ ? 0 hours; measurement after 24 2 hours at room temperature no visual damage ? c/c: 2% max. or 1 pf max., whichever is greater q: 30 pf, q 350 10 pf c < 30 pf, q 275 + 2.5c c < 10 pf, q 200 + 10c r ins : 1 g ? min. or 50 ? f min. whichever is less test procedure requirements

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